Plating Technology
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The main techplating technology based on theory and
experience is used in a wide range of industries
such as electronic components, semiconductor,
automobile, medical, space, and precision machinery.
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I can electrolytic plating or electroless plating semiconductor wafer
UBM fabrication by electroless plating or bump-fabrication of several tens of micrometer by electroplating, on the electrodes (Al or Cu) of of semiconductor wafers
Plating technology for powder-form materials:
By a nanometer-scale metal layer plating, additional properties such as conductivity, abrasion resistance , corrosion resistance, and sinterability are added to micrometer-scale powder-form-materials which have one originally.
We may meet your request for SMDs such as 0603 or 0402 devices by our application performance and achievement
Cu filling into through-silicon via (TSV) by plating.
KIYOKAWA takes TSV plating from seed metal plating to filling with our original technology to meet your requirements.
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Plating technology for TSV |
Cu filling into through-silicon via (TSV) by plating. |
Mass production technology based on our achievements and know-how in 35 years !! High quality, short lead time, and low cost for your products.
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Barrel plating |
In barrel plating method, plating can be a large amount at one time a small product |
Plating on ceramic boards such as LTCC (Low Temperature Co-fired Ceramics) boards or resinous boards for the purpose of solder junction or wire bonding
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