Plating technology for powder-form materials
Plating on various shapes of powder is available
Enable a uniform plating to each particle
Plating with keeping good dispersivity even for the easy-to- aggregate powder by our original technology.
Flat appearance with no abnormal depositions or craters.
Show good conductivity by plating of low-resistance metals such as Au.
* This graph is one example. conductivity is varied from base materials, particle size, and powder condition.
Enable electric conduction to insulating particles by metal plating
Improvement of corrosion resistivity
Development of sinterability