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Plating technology for small SMD

Plating technology for small SMD:

Plating on electrode of small SMD such as 0603 or 0402 devices is conducted for solder junction. Plating even on 0402 devices, ultra low resistance devices, or LTCC chip is applicable.

1. Plating specification

1. Plating specification / Plating technology for small SMD

 

2-1. Features

2-1. Features / Plating technology for small SMD

   

2-2. Features

2-2. Features / Plating technology for small SMD

2-3. Features

2-3. Features / Plating technology for small SMD

3. Shipping inspection

3. Shipping inspection / Plating technology for small SMD

4. Other features

•Technology and analytical capacity based on our achievement.
•Applicable to variety types of products and plating metals.
•Respond positively to the closed products.
•Enable mass production from hundreds to millions of devices per batch.
•Acceptable plating on 0201-size devices.

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