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Plating technology for TSV

Plating technology for TSV

Plating technology for TSV / Plating technology for TSV

Cu filling into through-silicon via (TSV) by plating.
KIYOKAWA takes TSV plating from seed metal plating to filling with our original technology to meet your requirements.

Available wafer size

Available wafer size / Plating technology for TSV

Feature 1

Feature 1 / Plating technology for TSV

Enable good filling performance by reinforcing a seed layer by an eletcroless plating.

Feature 2

Feature 2 / Plating technology for TSV

Adoptable various type of plating as your specification!
For example: one-time plating of both through hole and line-patterning simultaneously, results in CMP less.


 

Acceptable an order …

・of plating to through-hole.
・of one-time-plating to through hole and pattering
・for both-sides plating.
・without CMP process
・from a single wafer.

Plating technology for semiconductor fields

・Electroless UBM plating
・Electrolytic micro-bump plating
・Re-patterning plating 

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