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Plating technology for ceramic and resinous printing writing boards

Plating technology for printing writing boards

Plating on ceramic boards such as LTCC (Low Temperature Co-fired Ceramics) boards or resinous boards for the purpose of solder junction or wire bonding

1. Specifications

1. Specifications / Plating technology for ceramic and resinous printing writing boards

 

2. Features

2. Features / Plating technology for ceramic and resinous printing writing boards

・Plating Au layer for solder junction or wire bonding
・Also acceptable electroless Ni/Au and Ni/Pd/Au
・One-side plating on boards is available (with masking)
・Thick Au plating of 1.0μm is also acceptable
・Adaptable for small-size electrode of φ50μm
・Small damage to LTCC boards

2. Features

2. Features / Plating technology for ceramic and resinous printing writing boards

・Compliant for RoHS and other environmental control
・Electroless high P-Ni plating is available for nonmagnetic applications
・Electroless Ni-B plating is adaptable for high temperature junction 

3. Other features

3. Other features / Plating technology for ceramic and resinous printing writing boards

・Our wide experience can solve various quality failures.
・Ready for electrostatic discharge protection
・Acceptable small quantity production of several number of boards
  

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