Plating technology for ceramic and resinous printing writing boards
Plating technology for printing writing boards
Plating on ceramic boards such as LTCC (Low Temperature Co-fired Ceramics) boards or resinous boards for the purpose of solder junction or wire bonding
・Plating Au layer for solder junction or wire bonding
・Compliant for RoHS and other environmental control
3. Other features
・Our wide experience can solve various quality failures.